Geehy Launches the First High-Performance APM32F407IGH6 MCUs in BGA Package

Release time:

2023-08-01 15:59

APM32F407IGH6-cover.png

 

The APM32F407IGH6 is an industrial-grade high-performance MCU in a BGA176 package. Having rich system resources, an easy-to-use architecture, and excellent peripheral features of the Arm® Cortex®-M4F core, its compact size helps customers design smaller PCB boards and applies in fields of medical and high-end consumer electronics.

 

Small Size Exudes Big Power

Thanks to its BGA package, the APM32F407IGH6 has a small size of 10mm x 10mm and higher pin density with larger pin spacing compared to other chips in the same series.

The BGA short pin design helps shorten the signal transmission path, reduce lead resistance/inductance and signal transmission delay, and increase the adaptation frequency, which can effectively optimize the circuit performance.

 

The BGA solder ball has a large contact area with the substrate and a shorter path, which allows the APM32F407IGH6 to transfer heat more effectively and has better heat dissipation performance. The shorter lead design also reduces signal loss, improves anti-interference and anti-noise performance, and is more suitable for complex application scenarios.

 

APM32F407IGH6 Specification

●Based on a 32-bit Arm® Cortex®-M4F core

●Operating frequency of 168MHz, Flash 1MB, SRAM 192+4KB

●Support single-precision FPU and enhanced DSP

●Built-in true random number generator and support BN, SM3, and SM4 algorithms to meet security encryption needs

●Operating temperature covers -40℃~+105℃, ensuring stable operation under complex industrial-grade temperature scenarios

 

F407IGH6 Chip Block Diagram.jpg

 

Contents from Greehy

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